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Posted on April 19, 2017

New equipment developments: The new Easycoater

Printed, Organic & Flexible Electronics Forecasts,
The very successful S2S unit Easycoater from Coatema got a complete redesign. The focus is on functionality, modularity and ultimate precision. The unit is capable of slot die coating, doctor blade and flat screen printing and a number of drying and crosslinking options.
Different precision levels and sizes are available and for printed electronics the Easycoater version has all movements of the table and the application station in micron accuracy, including a one micron precision vacuum table.
All standards from the former EC like being able to handle solvents, offering inert gas environment layouts are also available for the new Easycoater. A new machine design makes all parts easy accessible and the unit shows with the unique LED design feature the modus of operation to the operator.

UV Nanoimprint is the new Hot Topic

The cooperation between
×Coatema Coating Machinery
Coatema Coating Machinery
is exhibiting at the
IDTechEx Show!
Santa Clara Convention Center, CA, USA
15 - 16 Nov 2017
Coatema Coating Machinery and temicon has revealed a brand-new R2R-Nanoimprint line. The new TEMICOAT line allows nanoimprinting of seamless structures on rolled products up to the width of 300 millimeters for various applications. At the same time, temicon has ordered with Coatema a TEMICOAT production line of one meter working width. This line is going to start operations in the second half of this year.
The existing corporation under the label TEMICOAT® is significantly moving ahead and now allows the manufacturing of various micrometer and sub-micrometers structures at atmospheric pressure. The scope of applications comprise lightguide structures, biomedical sensors, microfluidic, decorative and haptic surfaces.
E-Textiles 2017-2027: Technologies, Markets, Playe
Image sources: Coatema
Learn more at the next leading event on the topic: Business and Technology Insight Forum. Japan 2017 External Link on 27 - 29 Sep 2017 in Tokyo, Japan hosted by IDTechEx.