Startup company Tri-D-Innov provides additive metallization for plastic and composite materials electronic packaging, is linked through a closed partnership with equipment manufacturer Kelenn Technology, launching the new Kelenn Technology DMD 100, an off-contact digital dispenser which deposits the TDI thick film formulation EOPROM (primer formulation for metallization process) showcasing their prototype circuits which have been manufactured with the DMD 100, depositing their EOPROM thick film formulation on molded device. TriDInnov's technology brings to the electronic packaging market a new manufacturing process which reposition the MID towards new business areas such as to add value on composite materials especially in the automotive area. They are to invest in a technology platform in order to manufacture MID prototypes circuits for their customers in order to push their technology acceptance on the market place. Filmed at the IDTechEx Show! Berlin 2017. Learn more: www.IDTechEx.com
Learn more at the next leading event on the topic: Printed Electronics USA 2017 on 15 - 16 Nov 2017 in Santa Clara Convention Center, CA, USA hosted by IDTechEx.