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Press Release
Posted on October 18, 2010

Flextech Alliance awards grant to Corning Incorporated

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The FlexTech Alliance, focused on developing the supply chain for displays and flexible, printed electronics, have announced that it has awarded Corning Incorporated a grant to develop commercially viable methods for continuous printed electronic manufacturing on flexible glass substrates.
 
The general substrate design and process methods identified will be applicable to a wide range of applications including sensors, energy harvesting and storage, displays, and solid state lighting. The research is being done in conjunction with Binghamton University's Center for Advanced Microelectronics Manufacturing (CAMM) and Western Michigan University's Center for the Advancement of Printed Electronics (CAPE).
 
The project goal is to demonstrate working devices made by roll-to-roll printing technologies. It will rely on selected organic photovoltaic (PV) devices to evaluate program progress and demonstrate the benefits of flexible glass substrates. Beneficial characteristics of glass include inherent barrier properties for device hermeticity, low surface roughness, compatibility with device processing chemicals, high temperature capability for high quality thin film deposition and minimal distortion with applied stress.
 
"Corning's flexible glass substrates will be a keystone component enabling low-cost, high-quality device processing," said Dr. Dipak Chowdhury, program director, flexible glass substrates. "This project uses organic photovoltaic devices as target structures. However, there are a number of applications that can benefit from the inherent qualities of glass, including e-paper, color filters, OLED lighting, large-area sensors, display backplanes and additional photovoltaic devices."
 
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"Corning and CAMM recently demonstrated the general compatibility of a flexible glass web in a roll-to-roll system," said Peter Borgesen, PhD, Director of the CAMM. "Flexible glass is an optimum electronic substrate material and the CAMM at Binghamton University is delighted to have a role in helping to demonstrate that it is a viable substrate solution for roll-to-roll flexible electronics fabrication."
 
"The collaboration of Corning with Binghamton University's CAMM and Western Michigan University's CAPE exemplifies the synergy that FlexTech Alliance strives to facilitate," said Michael Ciesinski, chief executive officer, FlexTech Alliance. "Our long-standing relationship with these organizations gives us confidence in the successful outcome of this project."
 
The FlexTech Alliance R&D program is a collaborative effort of private industry and the U.S. Army Research Laboratory, located in Adelphi, Maryland. The CAMM is a partnership between Binghamton University (BU), Endicott Interconnect Technologies (EI), Cornell University and the Flex Tech Alliance.