Light weight flexible 5 meter CIGS based PV laminate breakthrough

Ascent Solar Technologies, Inc a developer of state-of-the-art, flexible thin-film photovoltaic modules, announced that the company has manufactured a monolithically interconnected 5 meter long flexible light weight module on a polyimide substrate.

 

The lightweight design is expected to allow the module to be hand-carried if needed, as opposed to glass modules that have to be hoisted with a crane across rooftops. The module can produce 123 watts under standard test conditions with an aperture area efficiency of 9.1 percent.

 

This length is a baseline for the company's development of large area flexible building integrated photovoltaic (BIPV) products with its strategic BIPV partners.

 

"This is the largest monolithically interconnected CIGS (copper indium gallium di-selenide) module on polyimide and may be the largest of any CIGS module regardless of construction," said Ascent's Prem Nath, senior vice president for product operations, in a news release. "The size and efficiency of this module make it a breakthrough for the emerging opportunities of flexible CIGS photovoltaic modules."

 

Ascent Solar has developed an integrated processing technique of CIGS production on high-temperature plastic substrate.

 

Ascent's Director of Investor Relations Brian Blackman said he knows of one other small European company working in this area that's still in the research and development phase.

 

The CIGS based thin film material used in this module was manufactured using the company's unique 1.5 MW roll-to-roll manufacturing line. The module was encapsulated during the testing and qualification of equipment at the company's new 30 MW plant under construction in Thornton, Colo., Blackman said.

 

Production is expected to start at the more than $100 million facility at the beginning of 2010. The company's headquarters, also in Thornton, were purchased in 2008.

Ascent Solar Technologies, Inc. is a developer of thin-film photovoltaic modules with substrate materials that can be more flexible and affordable than most traditional solar panels. These modules can be directly integrated into electronics, military and consumer portable power products, transportation systems, building elements, and space / near-space applications resulting in market differentiated solutions.

 

For more attend Photovoltaics Beyond Conventional Silicon USA 2009  Dec 2-3, San Jose, USA.

 

Also read Thin Film Photovoltaics and Batteries 2009-2029  and Inorganic and Composite Printed Electronics 2009-2019 .

 

Source: Ascent Solar Technologies