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Inorganic and Composite Printed Electronics 2009-2019 
World's only report on these technologies, presenting forecasts, players, technologies and opportunities


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The Impact of Printed Electronics on the Printing Industry 
Dr Reinhard R Baumann, Head of Special PrintMedia Projects MAN Roland Druckmaschinen AG, Germany at Printed Electronics USA 2005

New Solutions for Ink Jetting Electronics 
Dr Linda Creagh, Business Dev Director, Materials Deposition Div Dimatix, Inc., United States at Printed Electronics USA 2005

How far away are Production InkJet Systems?" 
Mr Mark Hanley, President IT Strategies, United States at Printed Electronics USA 2005

A Comparison of IJ Printed Conductors to Conventional Processes 
Mr Chuck Edwards, General Manager, PEDs Cabot Superior Micropowders, United States at Printed Electronics USA 2005

Reel to reel production of polymer electronics 
Staffan Nordlinder, Acreo, Sweden at Printed Electronics USA 2005

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Suitability of printing technology (part 4)
18 January 2005
Country:

Suitability of printing technology (part 4)

 
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In this fourth article on printing technology for printed electronics, we look specifically at technologies for making Thin Film Transistor Circuits TFTCs using soluble semiconducting inks. That has meant polymers but
×IBM
IBM
is presenting at
Printed Electronics & Photovoltaics USA 2010
Santa Clara, CA, USA
1 - 2 Dec 2010
IBM is making progress in developing inks employing precursors of monomers - specifically oligomers - and these have better electronic properties including carrier mobility. It described this success in the IDTechEx conference Printed Electronics in New Orleans in December 2004.
 
A wide variety of conventional and new printing technologies are being used or tested for the printing of electronic circuits of various types. However, the varied nature of th
×e ink
e ink
is presenting at
Printed Electronics Asia 2010
Hong Kong
13 - 14 Oct 2010
e inks available to create such circuits and the diversity of circuits required means that no one printing technology will ever be used for all applications. Indeed, the evolution of new conducting, semiconducting, dielectric, battery and other inks with new physical characteristics means that the printing technologies chosen or adapted will be constantly changing for some time to come.
 
Progress with printing techniques for TFTCs largely revolves around getting shorter channel length ie source drain distance reduced to increase the maximum frequency possible. This opens up more applications in many areas such as telephony and RFID. This progress can be seen by reviewing the summary presented by Avecia in 2002 below. However, there is also need for dielectric layers, passivation layers and conducting layers. Not all are ready in terms of either inks or processes.
 
For example, OrganicID, which intends to be the first with a commercial TFTC that is printed with polymer semiconductors on flexible substrates is using conductive polymer for some but not all conductors because this so called PEDOT has many magnitudes worse conductance than metal films. Indeed some initial TFTCs will have vacuum deposited aluminium conductors to start with - no a printing process at all. Connecting electrodes and antennas will often be screen printed initially - a slow and wasteful process but it gives the necessary thickness ie conductance with conventional silver inks.
 
Source: Avecia
 
Here IJ means ink jet. Today, the proponents of ink jetted TFTCs such as Plastic Logic and Xerox/
×PARC
P
×ARC
ARC
is presenting at
Future of Electric Vehicles USA 2010
San Jose, CA, USA
7 - 8 Dec 2010
ARC
is exhibiting at
Printed Electronics & Photovoltaics USA 2010
Santa Clara, CA, USA
1 - 2 Dec 2010
PARC see progress towards one micron resolution. Those developing the high speed reel to reel processes on the right see progress towards sub ten micron resolution. Indeed
×PolyIC
PolyIC
is exhibiting at
Printed Electronics & Photovoltaics USA 2010
Santa Clara, CA, USA
1 - 2 Dec 2010
PolyIC demonstrated a working 13.56 MHz RFID tag at the IDTechEx conference Smart Labels Europe in late 2004.
 
 
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