Printed, Flexible and Organic Electronics

Thin, flexible fibers made of carbon nanotubes have now proven able to bridge damaged heart tissues and deliver the electrical signals needed to keep those hearts beating.

FlexEnable, the leader in the development and industrialisation of flexible organic electronics, has revealed an ultra-narrow border organic LCD (OLCD).

Researchers have developed biodegradable microresonators that can be heated locally with a wireless system. Doctors could soon be using them in implants to control the release of painkillers within tissue.

The e-paper displays offer hospitals enhanced communication with staff and patients by replacing handwritten whiteboards with low power, highly readable E Ink based displays that pull essential information from the Electronic Health Record to clinical staff and patients areas, ensuring accurate communication and information exchange.

Stanford engineers have developed experimental stickers that pick up physiological signals emanating from the skin, then wirelessly beam these health readings to a receiver clipped onto clothing. It's all part of a system called BodyNet.

When food is recalled due to contamination from bacteria such as salmonella, one may wonder how a tainted product ended up on store shelves. New technology being developed could give retailers and regulators an earlier warning on dangers in food, improving public health and giving consumers peace of mind.

Thin films made of carbon nanotubes hold a lot of promise for advanced optoelectronics, energy and medicine, however with their manufacturing process subject to close supervision and stringent standardization requirements, they are unlikely to become ubiquitous anytime soon.

On November 20th and 21st, the 16th annual Printed Electronics USA event will take place in Santa Clara, California - the heart of silicon valley. Record bookings to date include 178 exhibiting companies, hailing from 25 countries, and a total of 250 speakers. The event is expected to exceed 3,500 attendees. Attendees registering by August 16, 2019 can save 30%.

The electronics manufacturing world has long been searching for a low-heat or no-heat solder solution. Advanced electronics designs with lightweight flexible substrates or sensitive miniaturized components require a dramatic reduction in processing heat while still meeting high operating temperature requirements.