Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging

As reported by Nvidia's Q2 financial statement, its second-quarter data center's revenue was a record US$10.32 billion, up 141% from the previous quarter and up 171% from a year ago. With the increasing demand for high-performance servers in data centers, IDTechEx has seen challenges in data center thermal management and tremendous opportunities in this industry.

Thursday 12 October - An introduction to EMI shielding for electronics, including the transition from board/enclosure level shielding to package level shielding; How trends in semiconductor packaging such as heterogeneous integration will affect EMI shielding requirements and demand for novel deposition capabilities; Emerging materials for EMI shielding, including particle-free (molecular) conductive inks and MXenes

2022 saw the aerogels market take a large leap forward with the success of electric vehicle (EV) batteries as an application. Historic growth has been steady for other applications, but with the growth fuelled by the EV market, there is the opportunity for several other applications to take advantage of the scaling production volume.

It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. As such, increasing efforts are being made to mount integrated circuits (ICs) and other components such as antennas closer together, sometimes within the same semiconductor package.

Can digital and/or high throughput manufacturing be applied to circuit boards? Can stretchable electronics be produced without sacrificing processing capabilities? Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that aims to resolve both of these questions.

The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.

Aerogels have experienced steady market growth historically, reaching a market of just under US$450 million in 2022. Progress has been somewhat slower than some would expect; this has largely been due to competition with lower-cost incumbent insulation materials.

The market for nanomaterials, especially nanocarbons, continues to grow - reflecting the potential to unlock several next-generation technologies. Most notable for carbon nanotubes (CNTs) is incorporation in lithium-ion batteries, with production ramping up to fulfill demand, while major players are making acquisitions and expanding, leading to market consolidation.

Thursday 17 August 2023 - An introduction to FHE, including motivating factors; Discussion of recent innovations and commercial developments within FHE; Identification of technological gaps and potential solutions; A roadmap for how the industry will develop, spanning both technologies and applications.

Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs.

How far is printed/flexible electronics along the road to widespread adoption? The emerging manufacturing methodology, which replaces etched copper laminate with printed conductive inks on flexible substrates, offers multiple benefits, including flexibility/stretchability, the potential for low-cost roll-to-roll production, digital manufacturing/rapid prototyping, and improved sustainability.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Thursday 27 July 2023 - Surging Demand for Lithium-Ion Batteries Driving the Carbon Nanotube Market. 10-year market outlook for CNTs; Analysis of CNT usage in the energy storage industry, including technology trends in LiBs and next generation batteries; Overview of other key applications; Discussion of key players and supply chain pain points; Emerging technologies incl. green feedstock

The energy storage market is booming, driven predominantly by the electrification of the transportation sector. With the increasing demand for lithium-ion batteries (LiB), significant attention has been given to the supply chain of materials for LiBs beyond lithium itself. Carbon nanotubes (CNTs) are gaining traction as a conductive additive at the cathode of LiBs, paving the way for significant expansion in the CNT market.

Wednesday 12 July 2023 - An introduction to printed and flexible electronics, including motivating factors; Assessment of product-market fit across the application space, including discussion of use cases seeing most commercial traction; A selection of recent innovations, spanning materials, components, and manufacturing methods; A roadmap for how the industry will develop, spanning both technologies and applications

Walk around the aisles of a local shop: aside from the prices, little has changed since the introduction of the bar code in the 1970s. While customers have smartphones in their pockets and there are sophisticated inventory management systems in the background, the digital revolution has yet to alter the packaging of most consumer items.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

What do electronic skin patches, thin-film flexible photovoltaics and automotive interior consoles have in common? All are produced using printed & flexible electronics, an alternative approach to conventional printed circuit boards that combines additive manufacturing with flexible substrates.