Printed Electronics World
Jun 4, 2024
Die-Attach Material Trend For EV Power Electronics
Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the future results in higher junction temperatures and increased demand for die-attach materials in EV power modules. In traditional Si IGBT power modules, die-attach materials like Pb95Sn5 and Pb92.5Sn5Ag2.5 struggle to meet reliability requirements for packaging power devices in high-temperature applications due to creep-fatigue concerns.