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Press Release
Posted on October 10, 2017

Attaching metals to non-metal materials

REPORT: Fiber Lasers 2018-2028
The Cuptronic Process is a revolutionary new way of attaching metals like Copper, Nickel, Silver and Gold to a variety of surfaces. Today's technologies for metal-adhesion to non-metallic surfaces rely mainly on mechanical adhesion by first etching up a rough surface (down into the surface). Current technologies have several problems, three of which being adhesion, production cost and the use of Chrome +6 for etching. The Cuptronic process chemically attaches (up from the surface), customized polymer structures, or "strings", with a covalent bond on the surface. On these polymer strings we can deposit conventional electroless metals.
The process is applicable on a wide variety of materials, even transparent plastic and certain Teflon® materials. This does not only solve several existing problems customers have, but also opens up totally new business opportunities in metallized plastics, components for the car industry, PCB board design, medical devices, as well as many other fields. By being able to metallize very smooth surfaces this new technology cannot only improve properties of the end products, it can also simplify, decrease the cost, and increase the yield of the production process.
The Cuptronic Process is easy to scale up and utilizes conventional technics and equipment well known to the industry: apply the Cuptronic chemistry by appropriate coating technique (e.g. spray, dip or roller coat) and activate the Cuptronic chemistry by exposing it to a specific UV light (flood light or laser). Finally use conventional plating technology to desired metal thickness.
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Two projects are in industrialization stage and several other development projects are on-going which can be seen in the PowerPoint presentation. The business model is to license the process know-how and patents to manufacturers.
Ultra High Frequency PCB
Using the Cuptronic Process in PTFE board manufacturing should lead to better high frequency properties due to very smooth surface (no teeth) under the copper and no under etching, and also to a cost reduction in PCB production by eliminating several steps in the traditional manufacturing process.
We also believe that yield will increase in production mainly due to the elimination of the etching process and the simplicity, control and robustness of the Cuptronic Process. The Cuptronic Process uses traditional PCB equipment, which is easy to integrate in parallel into current PCB manufacturing facilities. We have worked with three different PCB manufacturers on the RFS/Alcatel project.
To download a PowerPoint presentation (copy in Browser and Download presentation).
Further information
For more information please contact:
Peter Sjobeck, CEO Email: Cuptronic Technology AB phone: +46 - 70 - 730 0000
Source and top image: Cuptronic
Learn more at the next leading event on the topic: Printed Electronics USA 2018 External Link on 14 - 15 Nov 2018 at Santa Clara Convention Center, CA, USA hosted by IDTechEx.