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Printed Electronics World
Posted on December 20, 2017 by  & 
External Company Press Release

IKEA Open Innovation Challenge in Printed Electronics

IKEA has invited a selection of companies to propose innovative ideas and technologies aiming at E-labels and/or Digital Communication Carriers.
This Open Innovation targets technologies based on Printed Electronics and IKEA has elected to work with RISE Acreo as a technology partner in Open Innovation.
The communication carriers are media conveying information, analog today, attached to IKEA products or as in-store communication.
IKEA wishes to investigate the possibilities for digital communication carriers, by means of novel hard- and software technologies, coupled with technical services supporting the IKEA customer, operations and/or enhancing the IKEA experience - creating customer value.
Ask for the full text describing the E-label challenge:
Ask for the full text describing the Digital Communication Carrier challenge:

Invisense awarded with Skapa prize

RISE Acreo spin-off Invisense is the proud winner of the prestigeous SKAPA prize and are now winning it's first clients, among them construction companies PEAB and Myresjöhus.
  • We're also proud to be shipping our first serially produced passive humidity labels, says CEO Björn Garplind.

Monolithically integrated supercapacitor modules

Creating energy storage and control electronics in one integrated device could lead to lower costs. In the Modulit project electrochemical cells, interconnects and circuits for protection against overcharging, balancing and charge levels are printed on one single substrate - inspired by the groundbreaking development of monolithic integration (IC's) in microelectronics.
A layer-by-layer (LbL) deposition of redox polymers on cellulose aerogel has been explored as a new method to immobilize organic redox molecules on a renewable carrier material.
Financed by: the Swedish Energy Agency
Participants: RISE Acreo AB, KTH, LiU, MiUN, RISE Bioeconomy, RISE SICS.

Smart label for vaccine monitoring - shifting gears

We're joining forces with cold chain experts TSS Temperature Monitoring Systems, FLEX, Beneli and Imprint Energy in a second stage project, aiming at upscaling and stabilizing the production of the Smart Cold Chain Indicator - a small device which monitors temperature deviations in supply chains, stores some 7000 datapoints and uses an intuitive display as a key differentiator. The display will help field personel in Last Mile scenarios interpret data correctly, making sure vaccines are not forfeited.
The sCCI has been designed by MSF Sweden Innovation Unit and during q1 2017 took part in a minor trial in Bangladesh.
  • It's a real challenge to scale up from R&D and bring novel technology to market. It might be the golden egg, but requirements are tough on robustness and quality, says David Nilsson, Senior Scientist at RISE Acreo.
Contact us to learn more

The Global Vaccine Alliance - challenges in the cold chain

GAVI was created in 2000 with the goal of creating equal access to new and underused vaccines for children living in the world's poorest countries.
Almost half a billion vaccinations have been administered since the start, making GAVI a very important player in the world of pharma and cold chain monitoring.
A multitude of governments and players such as Bill and Melinda Gates Foundation, WHO, Unicef all take part in achieving GAVI's targets.

Minimized contacting real estate

A large part of the real estate available in hybrid smart labels is consumed by pads for interconnects and bonding.
In the SiOS project, a technology is developed to merge silicon-based and organic-based electronics, to minimize contacting areas. OECTs, operating at low voltage, are manufactured on flexible substrates with screen printing.
A variety of different circuits based on these transistors was recently published in the journal Flexible and Printed Electronics (IOPscience) to demonstrate the concept:.
  • Collaboration with RISE SICS East and Linköping University
  • SiOS: Silicon-Organic Hybrid Autarkic Systems
  • Financed by the Swedish Foundation for Strategic Research (SSF)
Contact us to learn more

Coating polymer spheres with graphene

In a very exciting graphene-project, GNOME ACA, we're developing metal-free anisotropically conducting adhesives (ACAs) together with industrial partners Scandidos and AkzoNobel. The ACAs may be used to connect components by non-corroding contacts, and enable manufacturing of radiation sensors for medical purposes.
Funding provided through the Graphene innovation support program in Sweden:
SiO Grafen

Smart filters and materials for purification of water and air - TerraClean

Access to pure water and air is quintessential for life. In Mistra TerraClean, smart materials are engineered from indigenous raw materials, such as cellulose and mesoporous inorganic materials. Sensors to use filter materials are used as active sensor material, and connected to enable direct monitoring of the state-of-health of filter materials.
TerraClean is joint effort with several institutes and universities in Sweden and RISE Acreo is a proud partner.
Timeline: 2017-2021
Funding in total 6M Euros, mostly by Mistra.

RISE Acreo to co-operate with RDOT

RISE Acreo recently initiated a closer collaboration with Gothenburg-based startup RDOT regarding sales & development of display technologies.
RDOT holds previous ip in the plasmonic space and Acreo is well positioned in the electrochromic display field.
  • We're looking forward to being a part of this journey, says RDOT CEO Felix Karlsson.
Contact us to learn more

Create your own electronic papers

The Packaging Greenhouse and RISE Acreo will be organising a two day course in electronic papers at the Printed Electronics Arena (PEA) in Norrköping during spring 2018.
The course is the first of its kind, bringing new challenges and possibilities with electronics in paper and carton with focus on printing technologies. If you're interested, get in touch!
Get in touch!

Ahead of 3d-printing

Nextfactory combines additive manufacturing, 3D-mapping, micro-assembly and curing in one machine unit. The input is functional inks, adhesives, components and a CAD-drawings, and the output is a product prototype.

New machines from DPPATTERNING

DryPhasePatterning, one of the RISE Acreo spinoffs, recently announced the shipping of two new machines, and we are particularly in love with the baby blue racing-inspired colour.
The DPP makes etching become old-school as it uses a subtractive process to manufacture patterns in metal coated thin films, for instance creating heating elements or rfid-antennas at high speed.
Contact us to learn more

Pressure ulcer prevention through stretchable electronics

Stretch-Light is a collaborative project between the Printed Electronics department at RISE Acreo and the Laboratory of Organic Electronics and PUsensor AB, an SME in pressure sensors. The aim is to create conformable and elastic PPG measurement patches for the prevention of Pressure ulcers in hospitalized patients.
We will embark on an exciting journey in cutting edge material science (e.g. stretchable inks), manufacturing strategies and data elaboration.
Contact us to learn more

40 million Euros to bio-based materials research

Our partner the Laboratory of Organic Electronics is one of the key players in a massive effort in Sweden - the Wallenberg Wood Science Center - with a continued funding of 40 M Euros. The Wallenberg Wood Science Center receives for its research on new bio-based materials from the forest.
The continuation of the research center, called WWSC 2.0, will be a collaboration between KTH, Chalmers, Linköping University and the forest industry.

RISE Acreo - Printed Electronics Arena: From molecule to prototype

The Printed Electronics Arena, operated by RISE Acreo, is a hub for printed electronics in Sweden. In close collaboration with the Laboratory of Organic Electronics at Linköping University, we help industrial clients from all over the world, from molecule synthesis to advanced circuit design in printed electronics and in hybrid systems with combinations of flexible substrated and mounted ic-components - creating minimal systems with advanced functionality.
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