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Press Release
Posted on February 28, 2018

20-micron resolution printer for high density electronics packaging

Structural Electronics 2018-2028
×Optomec
Optomec
is exhibiting at the
IDTechEx Show!
Santa Clara Convention Center, CA, USA
14 - 15 Nov 2018
Optomec, a leading global supplier of production grade additive manufacturing systems, has announced the Aerosol Jet HD System designed to address today's most demanding electronics packaging challenges - the increasing density of electronic components. The Aerosol Jet HD System is a compact, configurable production platform that can dispense a wide range of electronics materials with features as small as 20 microns. The system can also produce larger features, from 100's of microns to millimeters, and print wide-area conformal coatings from 100 nanometers to 10's of microns in thickness.
 
The Aerosol Jet HD System is based on Optomec's patented Aerosol Jet technology, a fine-feature material deposition solution used to directly print functional electronic circuitry and components onto low-temperature, non-planar substrates, without the need for masks, screens or subtractive post-processing. Based on the next-generation of Optomec's production-proven Aerosol Jet print engine, coupled with in-line automation, the HD System can handle a variety of substrate sizes and compositions, providing high-resolution printed electronics for today's most demanding advanced packaging applications such as 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.
 
Toxicant Materials and Alternatives in Electronics
"The demand for miniaturization of electronic systems, especially in mobile device, medical and mil-aero applications, has exposed a technology gap in advanced electronics packaging that current dispense solutions cannot address. With this announcement, Optomec offers a practical, seamless and cost-effective solution that can deliver an order of magnitude improvement in dispense resolution, addressing the advanced packaging needs of today and providing a pathway far into the future," said Dave Ramahi, CEO, of Optomec.
 
The compact, modular design of the Aerosol Jet HD System enables it to easily plug into almost any existing manufacturing environment to fill production gaps and provide new capabilities. The solution provides a turn-key approach to advanced electronics packaging with the Aerosol Jet Print Engine and tool path generation software integrated into a standard dispense automation platform.
 
In addition, production-ready recipes for a range of conductive, dielectric, adhesive and other materials, capable of extended runtimes and high yields are available with the initial product release.
 
Additional benefits of the new system include:
 
· Modular, interchangeable material cassettes and interchangeable print heads
 
· Ability to address printing requirements from small features (20 to 100 micron line width) to wide area coatings (millimeters to centimeters)
 
Transparent Conductive Films and Materials 2018
· Process runtimes exceeding 4 hours for production applications
 
Pricing and Availability
The Aerosol Jet HD platform, which includes the Aerosol Jet Print Engine, has an entry price of less than $150K. Product shipments are scheduled for late Q218.
 
About Optomec
Optomec is a privately-held, rapidly growing supplier of Additive Manufacturing systems. Optomec's patented Aerosol Jet Systems for printed electronics and LENS 3D Printers for metal components are used by industry to reduce product cost and improve performance. Together, these unique printing solutions work with the broadest spectrum of functional materials, ranging from electronic inks to structural metals and even biological matter. Optomec has more than 200 marquee customers around the world, targeting production applications in the electronics, energy, life sciences and aerospace industries. For more information about Optomec, visit http://optomec.com.
 
Source: Optomec
Learn more at the next leading event on the topic: Printed Electronics USA 2018 External Link on 14 - 15 Nov 2018 at Santa Clara Convention Center, CA, USA hosted by IDTechEx.