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Printed Electronics World
Posted on January 11, 2019

First commercial foldable smartphone with flexible display

Royole Corporation, a leading innovator and manufacturer of next-generation human-machine interface technologies and products, including advanced flexible displays, flexible sensors, and smart devices, has recently showcased its full line of industry-leading fully flexible display and flexible sensor technologies at CES® 2019. These advanced technologies are part of the company's Flexible+ platform, and are ideal for numerous applications in a variety of product categories, including Consumer Electronics, Sports & Fashion, Office & Education, Smart Home, and Robotics. For more information see the IDTechEx report on Flexible, Printed and Organic Electronics 2019-2029.
 
In addition to highlighting these categories, the company has demonstrated its groundbreaking fully flexible displays. The live demos underline the virtually limitless possibilities for flexible electronics technologies, including a look at the world's first commercial smartphone with a flexible display, FlexPai, a first-of-its-kind flexible display integration with high-definition fashion wearables - including a top hat and shirt, and its RoWrite Smart Writing Pad, designed to accurately create, capture, store, and share all manner of real-time, conventionally written material on standard paper for digital application.
 
"Royole's Flexible+ technologies have squarely put us in a leadership position in today's ever-evolving consumer technology industry," stated Royole's Senior Director of Marketing, Michael Williams. "We are currently working with over 220 business partners worldwide to implement flexible displays and sensors in a variety of products that will reshape the world of consumer technologies. The total number of improved consumer experiences is restricted only by our imaginations, and that is the very essence of the Royole Flexible+ platform."
 
The company's next-gen flexible display and flexible sensor technologies can be easily integrated into a variety of products and applications. Royole's patented flexible displays are thin, lightweight, and bendable, creating unique functionality and new applications. They feature high-resolution and high-color saturation for image clarity and quality.
 
Royole's flexible displays are produced at the company's quasi-G6 mass production campus in Shenzhen, China, a 100% self-designed, R&D and manufacturing facility with a total investment of around $1.7B.
 
The company has accumulated scores of intellectual property rights and key technical experiences covering all aspects of display manufacturing including materials, processing, devices, circuits, electronic systems and module development. This enabled Royole to introduce the world's thinnest (0.01 mm) full-color flexible display in 2014.
 
Royole officially launched the world's first commercial foldable smartphone with a flexible display, FlexPai, a combination of smartphone and tablet on October 31, 2018 in Beijing. Disrupting consumers' traditional concept of a smartphone, FlexPai can be used either folded or unfolded, giving it the portability of a smartphone plus the screen size of a high-definition tablet. FlexPai features Royole's independently developed and mass produced 2nd generation Cicada Wing fully flexible displays. The device can be bent freely from 0 to 180 degrees and supports more than 200,000 bends. Moreover, FlexPai 's screen cannot be cracked or easily scratched, ending the era of broken smartphone screens. When unfolded, FlexPai supports split-screen mode and multi-tasking; supports drag-and-drop across applications, enabling it to share features just as a computer does; automatically adjusts screen sizes; and provides enjoyable video-watching and gaming experiences. The developer model of FlexPai is available to order globally now. The consumer model is available to order to Chinese consumers.
 
Source and top image: Royole
Learn more at the next leading event on the topic: Business and Technology Insight Forum. Tokyo 2019 External Link on 20 - 21 Feb 2019 at Tokyo, Japan hosted by IDTechEx.