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Printed Electronics World
Posted on November 10, 2009 by  & 
External Company Press Release

Belair refocusing on flex operations

Belair cuts out ancillary services to focus solely on its 30-year flex/PCB production - with enhancements

Parent company Belair Industries has changed the business model at its flex and printed circuit board manufacturing plant in Alpharetta.
The company, which has had a core business of producing quality flex and PCBs for more than 30 years, changed its name 4 years ago to Belair Microelectronics to expand its services to include embedding small electronics into thin-profile applications. But after 4 years, both segments of the business have grown to the point that executives at the parent company Belair Industries felt it was time to split the two into separate segments to avoid distraction.
The flex/PCB operations, its experienced staff and its equipment will remain at 625B Sims Industrial Blvd. in Alpharetta and focus on the company's core operations - flex and rigid circuit fabrication. The only difference will be the new name, BELAIR SYSTEMS, and new contact information.
Belair Systems' operations will still be under the leadership of Chief Mechanical Engineer Joe Pline - a 30-year veteran of the company and one of the industry's leading experts in board etching and flex fabrication.
Geoffrey Smith will be promoted from product development director to vice president and will oversee all sales and marketing duties.
"The need for sophisticated and dependable flex manufacturers has grown over the last 10 years. And we consider our engineers to be among the best in the business," said Smith. "In an effort to capitalize on the growing demand and remain true to our core business, management felt it was time to refocus the company and concentrate solely on what we do best."
Focusing on flex and PCB production, Belair will implement several new cutting- edge processes learned while dealing in microelectronics which will enable its clients to design more complex, scaled-down and more cost-efficient circuits.
Two of these new processes are printed nano-silver and ACF bumping.
Printed nano-silver is the process of printing liquid silver directly onto substrates. Benefits include thin traces less than 20µm and the ability to print on a limitless variety of nonconductive substrates including PET, paper and even cloth. The highly involved process of etching circuits is erased and in many cases results in a substantial savings in product development.
ACF bumping is the process of etching small bumps onto the PCB for easy assembly using anisotropic conductive film.
Belair Industries began fabricating flex and rigid circuits 30 years ago in
Alpharetta, GA for manufacturers associated with the defense industry. In 1985 it was named 22nd on INC 500s fastest growing list and has retained a reputation for sending out quality product on time.
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