The 6th Innovations in Large-Area Electronics Conference (innoLAE 2020) returns to the Wellcome Genome Campus Conference Centre, Cambridge, UK on 21-22 January 2020, to deliver a programme highlighting the most innovative and exciting aspects of large-area electronics (LAE) - a new way of making electronics which includes printable, flexible, plastic, organic and bio- electronics.
innoLAE 2020 presents a high calibre programme combining plenary addresses from internationally-renowned speakers, parallel track oral presentations of latest research results, a poster session and drinks reception, an exhibition with leading companies showcasing their latest products- along with extensive networking opportunities, including a Gala Dinner in the historic Old Hall of Queens' College, Cambridge.
The innoLAE conference is attended by researchers, equipment suppliers, manufacturers, integrators and users to explore emerging technology and development of products in applications such as internet of things, flexible displays, energy harvesting, healthcare and wellness, smart packaging, e-textiles, wearables and integrated smart systems. innoLAE attracts equal interest from academia and industry, with the three days of innoLAE 2019 conference events attracting 300 delegates, representing 142 organisations from 21 countries.
Keynote talks will be given by
- Professor Sir Richard Friend, from the University of Cambridge, who pioneered the physics, materials science and engineering of semiconductor devices made with organic polymers. Professor Friend has also founded several spin-out companies.
- Dr Emre Ozer, Principal Research Engineer at Arm Research, is currently involved in developing bespoke machine learning compute engines on plastic coupled to plastic e-nose sensors.
- Professor Mark Poliks, Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton and leader for the New York State Node of NextFlex Manufacturing USA.
The presentations are wide ranging - including talks on in-situ printed electronics for spacecraft, biodegradable printed sensors for soil monitoring, shape-adaptive implants interfaced with the spinal cord, integration of electronic functionalities into 3D printed products and innovative R2R process equipment.
Highlights include a session focussed on LAE for energy including printed batteries, perovskite PV, electrochemical energy storage and RF energy harvesting on textiles. Other sessions feature printed sensors particularly those based on e-textiles and wearable devices for healthcare. Full details of the programme are available at http://innoLAE.org
- IMI Europe are running Short courses on Monday January 20th, visit imieurope for details
- CPI are hosting an industry networking event on the afternoon of January 20th, details here.
- Society for Information Display (UK and Ireland Chapter) are organising a seminar on emerging technologies for displays on Tuesday January 21st, more information.
How to get involved
- innoLAE 2020 is an ideal conference for researchers, business development professionals, process developers, manufacturing engineers, technology scouts and end-users, don't miss out - register here.
- Become a sponsor or exhibitor. Explore the variety of options increasing your visibility at the event here.
- Be part of the programme - submit a late-news abstract at http://innolae.org/innolae-2020-abstract-submission.
Conveniently situated just 20 minutes from Stansted airport, innoLAE 2020 will host researchers from around the world, giving speakers and delegates the chance to interact with key LAE decision makers, hear latest research results, network with colleagues, form new partnerships, and access an exhibition showcasing leading companies' latest developments, all under one roof! We look forward to welcoming you to this key event in the large-area electronics calendar.
Learn more at the next leading event on the topic: Printed Electronics Europe 2020 on 13 - 14 May 2020 at Estrel Convention Center, Berlin, Germany hosted by IDTechEx.