Hosted by IDTechEx
Printed Electronics World
Posted on March 16, 2021 by  & 
External Company Press Release

Introducing 3 New Copper Pastes

Copprint launched its first product a year ago. Despite the global pandemic, Copprint successfully fulfilled customer orders from across 25 countries worldwide, with repeat orders.
 
At the same time, silver prices surged by 60%, increasing material costs for most printed-electronics products, driving the industry to look for alternatives. For more information see the IDTechEx report on Flexible, Printed and Organic Electronics 2020-2030: Forecasts, Technologies, Markets.
 
Conductive pastes, with low sintering temperature and additional substrate support, were a common request. Copprint is proud to announce the addition of 3 new copper pastes to Copprint's product portfolio:
 
1.LF-360 for low-temperature sintering at 140-170°C on PET and PC.
2.LF-371 for thick trace printing on FR4, glass, aluminum.
3.LF-390 for polyimide (PI).
 
These pastes expand our portfolio, allowing customers to print conductive traces on PET, PC, Glass, FR4, Paper, Alumina, Aluminum, Teslin, PV wafers.
  • Highest conductivity in the market
  • 5-10X better price/performance compared to silver pastes
  • Simple and fast screen printing and sintering
  • Durable, solderable
  • Environmentally friendly, green circuits
  • Roll-to-roll and sheet-to-sheet implementations
 
 
 
Source: Copprint
More IDTechEx Journals