As part of the Department of Defense effort to partner with the private sector and academia in the new frontiers of manufacturing, Secretary of Defense Ash Carter announced that the Obama administration will award a Manufacturing Innovation Institute for Flexible Hybrid Electronics to a consortium of 162 companies, universities, and non-profits led by the FlexTech Alliance.
The announcement follows a highly competitive nationwide bid process for the seventh of nine such manufacturing institutes launched by the administration, and the fifth of six manufacturing institutes led by the Department of Defense. Part of the National Network for Manufacturing Innovation announced by President Obama in 2012, this newest institute will bring the best minds from government, industry and academia together to advance U.S. leadership in manufacturing flexible hybrid electronics. The emerging flexible hybrid electronics sector promises to revolutionize the electronics industry, and the Silicon Valley-based FlexTech Alliance consortium, backed by companies as diverse as Apple and Lockheed Martin and major research universities including Stanford and MIT, represents the next chapter in the long-standing public-private partnerships between the Pentagon and tech community.
A truly collaborative consortium, the FlexTech team includes more than 160 companies, nonprofits, independent research organizations and universities. The cooperative agreement will be managed by the U.S. Air Force Research laboratory (AFRL) and will receive $75 million in DoD funding over five years matched with more than $90 million from industry, academia, and local governments. In total, the institute will receive $171 million to invest in strengthening U.S. manufacturing.
Flexible hybrid electronics manufacturing describes the innovative production of electronics and sensors packaging through new techniques in electronic device handling and high precision printing on flexible, stretchable substrates. The potential array of products range from wearable devices to improved medical health monitoring technologies, and will certainly increase the variety and capability of sensors that already interconnect the world. The technologies promise dual use applications in both the consumer economy and the development of military solutions for the warfighter.
Source: US Department of Defense
Learn more at the next leading events on the topic:
Business and Technology Insight Forums - Tokyo, September 2018 on 12 - 13 Sep 2018 at Tokyo, Japan
or Printed Electronics USA 2018 on 14 - 15 Nov 2018 at Santa Clara Convention Center, CA, USAhosted by IDTechEx.