Hosted by IDTechEx

Printed, Flexible and Organic Electronics

Printed Electronics World
Apr 11, 2024
The Role of Printed Sensors in Mass-Digitization

The Role of Printed Sensors in Mass-Digitization

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
Printed Electronics World
Mar 22, 2024
Webinar: How & Why Is the Printed and Flexible Sensor Market Evolving?

Webinar: How & Why Is the Printed and Flexible Sensor Market Evolving?

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?
Printed Electronics World
Mar 22, 2024
Integration of DMS & OMS Offers Advancements for In-Cabin Monitoring

Integration of DMS & OMS Offers Advancements for In-Cabin Monitoring

In-cabin monitoring, comprising both Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS), has experienced significant growth since the start of 2024. Traditionally, DMS relies on 2D infrared cameras, while OMS utilizes 3D sensing modules like 3D time-of-flight (ToF) cameras or radar modules.
Printed Electronics World
Mar 20, 2024
Printed Electronics Converge: 3 Key Insights from LOPEC 2024

Printed Electronics Converge: 3 Key Insights from LOPEC 2024

In March, the printed electronics industry flocked to Munich once again for the LOPEC 2024 conference and exhibition. Featured were some of the latest printed electronics technologies addressing global mega-trends such as vehicle electrification, healthcare personalization, industry 4.0, and sustainability.
Printed Electronics World
Mar 13, 2024
Printed Sensor Technology: Evolving to Meet New Market Demands

Printed Sensor Technology: Evolving to Meet New Market Demands

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.
Printed Electronics World
Feb 23, 2024
Advanced Semiconductor Packaging Trends in AI and HPC

Advanced Semiconductor Packaging Trends in AI and HPC

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.
Printed Electronics World
Feb 22, 2024
Tesla Adopts Interior Radar for Interior Monitoring

Tesla Adopts Interior Radar for Interior Monitoring

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.
Printed Electronics World
Jan 16, 2024
Brand New Podcast: Tomorrow's Tech by IDTechEx

Brand New Podcast: Tomorrow's Tech by IDTechEx

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.
Printed Electronics World
Jan 10, 2024
Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.
Printed Electronics World
Jan 9, 2024
Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies
Printed Electronics World
Apr 11, 2024
The Role of Printed Sensors in Mass-Digitization

The Role of Printed Sensors in Mass-Digitization

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
Printed Electronics World
Mar 22, 2024
Integration of DMS & OMS Offers Advancements for In-Cabin Monitoring

Integration of DMS & OMS Offers Advancements for In-Cabin Monitoring

In-cabin monitoring, comprising both Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS), has experienced significant growth since the start of 2024. Traditionally, DMS relies on 2D infrared cameras, while OMS utilizes 3D sensing modules like 3D time-of-flight (ToF) cameras or radar modules.
Printed Electronics World
Mar 13, 2024
Printed Sensor Technology: Evolving to Meet New Market Demands

Printed Sensor Technology: Evolving to Meet New Market Demands

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.
Printed Electronics World
Feb 22, 2024
Tesla Adopts Interior Radar for Interior Monitoring

Tesla Adopts Interior Radar for Interior Monitoring

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.
Printed Electronics World
Jan 10, 2024
Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.
Printed Electronics World
Mar 22, 2024
Webinar: How & Why Is the Printed and Flexible Sensor Market Evolving?

Webinar: How & Why Is the Printed and Flexible Sensor Market Evolving?

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?
Printed Electronics World
Mar 20, 2024
Printed Electronics Converge: 3 Key Insights from LOPEC 2024

Printed Electronics Converge: 3 Key Insights from LOPEC 2024

In March, the printed electronics industry flocked to Munich once again for the LOPEC 2024 conference and exhibition. Featured were some of the latest printed electronics technologies addressing global mega-trends such as vehicle electrification, healthcare personalization, industry 4.0, and sustainability.
Printed Electronics World
Feb 23, 2024
Advanced Semiconductor Packaging Trends in AI and HPC

Advanced Semiconductor Packaging Trends in AI and HPC

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.
Printed Electronics World
Jan 16, 2024
Brand New Podcast: Tomorrow's Tech by IDTechEx

Brand New Podcast: Tomorrow's Tech by IDTechEx

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.
Printed Electronics World
Jan 9, 2024
Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies
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