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Barrier Layers

Barrier Films & Thin Film Encapsulation 2018-2028

Barrier Films & Thin Film Encapsulation 2018-2028

Barrier Films and Thin Film Encapsulation for Flexible and/or Organic Electronics 2018-2028 offers a detailed technology analysis assessing R2R multilayer barrier (MLB) film technologies, various inline thin film encapsulation (TFE) techniques, R2R spatial atomic layer deposition (s-ALD), flexible glass and more.
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