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Thermal Interface Materials

Market forecasts: die attach materials in EV power modules

Market forecasts: die attach materials in EV power modules

IDTechEx Research Subscribers
Metal sintering die attach materials, processes, and suppliers

Metal sintering die attach materials, processes, and suppliers

This is part V of our article series.
IDTechEx Research Subscribers
Review of current power modules in electric vehicles (HEV, PHEV, BEV)

Review of current power modules in electric vehicles (HEV, PHEV, BEV)

This part IV of our article series. In this part, we provide an overview of various power modules used in hybrid and pure electric vehicles today.
IDTechEx Research Subscribers
Technology evolution for the die and substrate attach paste

Technology evolution for the die and substrate attach paste

This is part III of our series on metal sintering in power electronics (PE). In the last two parts, we considered (1) the key trends shaping the power electronic technology, and (2) the key existing and emerging approach seeking to replace Al wire bonding to boost thermal reliability in PE packages. In this article, we examine how and why metal sintering is emerging as an alternative to, or as the next generation of, die attach technology, seeking to replace solder in demanding applications.
IDTechEx Research Subscribers
How interconnect technology in power electronic packaging is evolving

How interconnect technology in power electronic packaging is evolving

This is the second part of our article series on the potential use of metal sintering as a die attach paste material in electric vehicle (EV) power electronics (PE).
IDTechEx Research Subscribers
Trends in power electronics and their link to die attach technology

Trends in power electronics and their link to die attach technology

This series of articles focuses on the potential use of metal sintering pastes and materials in electric vehicle power electronics (PE). In the first part of this series (this article), we consider the key trends shaping power electronics.
Printed Electronics World
Aug 10, 2016
Consistent colour, long lifetime and high reliability for LEDs

Consistent colour, long lifetime and high reliability for LEDs

Managing temperatures using appropriate electronics packaging materials is essential to ensure the reliability of high-power LED applications.
IDTechEx Research Subscribers
Thermal Management tailored to the Application

Thermal Management tailored to the Application

Rachel Gordon attended Semi-Therm in San Jose to learn about thermal management in a wide variety of devices and industries. This article describes TIM requirements for different application areas.
IDTechEx Research Subscribers
Multi-scale Thermal Management

Multi-scale Thermal Management

Rachel Gordon attended Semi-Therm in San Jose to learn about thermal management in a wide variety of devices and industries.
Printed Electronics World
Sep 25, 2015
Thermal interface materials: Technologies and markets

Thermal interface materials: Technologies and markets

Overheating is the most critical issue in the computer industry. IDTechEx Research has assessed the needs, progress and opportunities to combat this in the report "Thermal Interface Materials 2015-2025".
IDTechEx Research Subscribers
Metal sintering die attach materials, processes, and suppliers

Metal sintering die attach materials, processes, and suppliers

This is part V of our article series.
IDTechEx Research Subscribers
Technology evolution for the die and substrate attach paste

Technology evolution for the die and substrate attach paste

This is part III of our series on metal sintering in power electronics (PE). In the last two parts, we considered (1) the key trends shaping the power electronic technology, and (2) the key existing and emerging approach seeking to replace Al wire bonding to boost thermal reliability in PE packages. In this article, we examine how and why metal sintering is emerging as an alternative to, or as the next generation of, die attach technology, seeking to replace solder in demanding applications.
IDTechEx Research Subscribers
Trends in power electronics and their link to die attach technology

Trends in power electronics and their link to die attach technology

This series of articles focuses on the potential use of metal sintering pastes and materials in electric vehicle power electronics (PE). In the first part of this series (this article), we consider the key trends shaping power electronics.
IDTechEx Research Subscribers
Thermal Management tailored to the Application

Thermal Management tailored to the Application

Rachel Gordon attended Semi-Therm in San Jose to learn about thermal management in a wide variety of devices and industries. This article describes TIM requirements for different application areas.
Printed Electronics World
Sep 25, 2015
Thermal interface materials: Technologies and markets

Thermal interface materials: Technologies and markets

Overheating is the most critical issue in the computer industry. IDTechEx Research has assessed the needs, progress and opportunities to combat this in the report "Thermal Interface Materials 2015-2025".
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