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Advanced Materials

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Advanced Semiconductor Packaging for Data Center GPUs

Advanced Semiconductor Packaging for Data Center GPUs

This premium article is aimed to give readers a comprehensive overview of advanced semiconductor packaging technologies utilized in server graphical processing units (GPU) in data centers.
External Company Press Release
Indium Corporation Partnership with SAFI-Tech, New Solder Products

Indium Corporation Partnership with SAFI-Tech, New Solder Products

Metallic soldering represents a key manufacturing process across many industries, including aerospace, automotive, and electronics. Current solder products trade off the reliability of joints formed with the very high processing temperatures needed to form those joints—a problem that has limited material selection and product design.
IDTechEx Research Subscribers
Graphene Membranes

Graphene Membranes

This premium articles explores recent developments and news regarding graphene membranes with an emphasis on filtration and other applications.
Printed Electronics World
Jul 12, 2022
New Event for Thermal Engineering Sector

New Event for Thermal Engineering Sector

Thermal Management Expo, is the only free-to-attend exhibition and conference dedicated to the thermal management sector, taking place on August 30-31 at the Huntington Convention Center of Cleveland, Ohio, USA.
IDTechEx Research Subscribers
Event Summary: Graphene at Advanced Materials Show 2022

Event Summary: Graphene at Advanced Materials Show 2022

IDTechEx attended the Advanced Materials Show on June 29-30, 2022 in Birmingham, UK. This premium article covers updates from companies operating within the graphene industry, including Ceylon Graphene Technologies, Gerdau Graphene, Graphene Layers, NeoGraf, and more.
Printed Electronics World
Jul 6, 2022
Low Temperature Nanoparticle Ink

Low Temperature Nanoparticle Ink

A simple and versatile nanoparticle ink could help next-generation perovskite solar cells to be printed at scale and become the dominant force in commercial photovoltaics. Made from tin oxide, the ink is created with just one key step at relatively low temperature using microwave technology, and without any need for further purification. It's then used in solar cells to help selectively transport electrons, a crucial step in generating electricity.
IDTechEx Research Subscribers
TIMs for ADAS: Players and Material Comparison

TIMs for ADAS: Players and Material Comparison

This premium article looks into thermal interface materials (TIMs) for advanced driver-assistance systems (ADAS), with an analysis of the key market players.
Printed Electronics World
Jul 5, 2022
Upcoming Webinar Discussing the 3D Printing Materials Market

Upcoming Webinar Discussing the 3D Printing Materials Market

Thursday 21 July 2022 - Exploring the Dynamics of the $29.5 Billion 3D Printing Materials Market. Benchmarking relevant materials/players; identifying growth drivers and trends to watch for different classes of AM materials; examining key market activity; IDTechEx's market outlook for the industry
Printed Electronics World
Jul 5, 2022
Can the Plastics Industry Become a Carbon-Capture Leader?

Can the Plastics Industry Become a Carbon-Capture Leader?

One of the major environmental issues facing the planet today is the rising levels of plastic consumption and waste. As carbon dioxide (CO2) emissions also soar, the emerging carbon capture and utilization (CCU) industry propose a solution for both issues: creating lower-carbon, degradable polymers using CO2 emissions as the feedstock.
Printed Electronics World
Jun 30, 2022
The Next Stage in Thermal Materials for 5G

The Next Stage in Thermal Materials for 5G

Whilst much of the "5G" infrastructure is a moderate upgrade on existing 4G technology, there is still plenty of scope for higher frequency deployment such as mmWave devices and very different station types such as small cells. Each of these new developments presents its own technological evolution and with it, thermal challenges.
External Company Press Release
Indium Corporation Partnership with SAFI-Tech, New Solder Products

Indium Corporation Partnership with SAFI-Tech, New Solder Products

Metallic soldering represents a key manufacturing process across many industries, including aerospace, automotive, and electronics. Current solder products trade off the reliability of joints formed with the very high processing temperatures needed to form those joints—a problem that has limited material selection and product design.
Printed Electronics World
Jul 12, 2022
New Event for Thermal Engineering Sector

New Event for Thermal Engineering Sector

Thermal Management Expo, is the only free-to-attend exhibition and conference dedicated to the thermal management sector, taking place on August 30-31 at the Huntington Convention Center of Cleveland, Ohio, USA.
Printed Electronics World
Jul 6, 2022
Low Temperature Nanoparticle Ink

Low Temperature Nanoparticle Ink

A simple and versatile nanoparticle ink could help next-generation perovskite solar cells to be printed at scale and become the dominant force in commercial photovoltaics. Made from tin oxide, the ink is created with just one key step at relatively low temperature using microwave technology, and without any need for further purification. It's then used in solar cells to help selectively transport electrons, a crucial step in generating electricity.
Printed Electronics World
Jul 5, 2022
Upcoming Webinar Discussing the 3D Printing Materials Market

Upcoming Webinar Discussing the 3D Printing Materials Market

Thursday 21 July 2022 - Exploring the Dynamics of the $29.5 Billion 3D Printing Materials Market. Benchmarking relevant materials/players; identifying growth drivers and trends to watch for different classes of AM materials; examining key market activity; IDTechEx's market outlook for the industry
Printed Electronics World
Jun 30, 2022
The Next Stage in Thermal Materials for 5G

The Next Stage in Thermal Materials for 5G

Whilst much of the "5G" infrastructure is a moderate upgrade on existing 4G technology, there is still plenty of scope for higher frequency deployment such as mmWave devices and very different station types such as small cells. Each of these new developments presents its own technological evolution and with it, thermal challenges.
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