Advanced Materials

The market for nanomaterials, especially nanocarbons, continues to grow - reflecting the potential to unlock several next-generation technologies. Most notable for carbon nanotubes (CNTs) is incorporation in lithium-ion batteries, with production ramping up to fulfill demand, while major players are making acquisitions and expanding, leading to market consolidation.

With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package.

Quantum dots (QDs) are semiconductor nanocrystals ranging from 2-10 nanometers (10-50 atoms) with size-tunable features. They exhibit quantum confinement effects due to their nanoscale dimensions, leading to remarkable optical and electrical characteristics

Quantum computers have the potential to tackle problems it would take classical computers trillions of years to solve. Most quantum computer designs depend on cooling the hardware to extreme temperatures well below -200 degrees Celsius.

Thursday 17 August 2023 - An introduction to FHE, including motivating factors; Discussion of recent innovations and commercial developments within FHE; Identification of technological gaps and potential solutions; A roadmap for how the industry will develop, spanning both technologies and applications.

Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs.

Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend

Li-ion batteries are widely used in various markets, such as in consumer electronics, electric vehicles (EVs) and stationary energy storage. However, as demand for Li-ion batteries continues to increase, the need to manage their sustainability through their entire lifecycle, including at end-of-life (EOL), is also becoming increasingly important.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.