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Advanced Materials

Printed Electronics World
Aug 25, 2023
Why Data Centers Adopt Cold Plates for Liquid Cooling Over Immersion

Why Data Centers Adopt Cold Plates for Liquid Cooling Over Immersion

The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.
Printed Electronics World
Aug 23, 2023
What Role Will Membranes Play in Carbon Capture?

What Role Will Membranes Play in Carbon Capture?

CCUS is a central part of every industrial decarbonization roadmap. At its heart, this is a separation challenge, which therefore brings about the question of whether membranes can be used.
Printed Electronics World
Aug 22, 2023
EVs to Dominate Aerogel Applications by 2025

EVs to Dominate Aerogel Applications by 2025

Aerogels have experienced steady market growth historically, reaching a market of just under US$450 million in 2022. Progress has been somewhat slower than some would expect; this has largely been due to competition with lower-cost incumbent insulation materials.
Printed Electronics World
Aug 16, 2023
Green Carbon Nanotubes: Reality or Good PR?

Green Carbon Nanotubes: Reality or Good PR?

The market for nanomaterials, especially nanocarbons, continues to grow - reflecting the potential to unlock several next-generation technologies. Most notable for carbon nanotubes (CNTs) is incorporation in lithium-ion batteries, with production ramping up to fulfill demand, while major players are making acquisitions and expanding, leading to market consolidation.
Printed Electronics World
Aug 11, 2023
Next-Generation RDL Materials in Advanced Semiconductor Packaging

Next-Generation RDL Materials in Advanced Semiconductor Packaging

With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package.
Printed Electronics World
Aug 9, 2023
Quantum Dots Unleashed: An Ever-Evolving Application Landscape

Quantum Dots Unleashed: An Ever-Evolving Application Landscape

Quantum dots (QDs) are semiconductor nanocrystals ranging from 2-10 nanometers (10-50 atoms) with size-tunable features. They exhibit quantum confinement effects due to their nanoscale dimensions, leading to remarkable optical and electrical characteristics
Printed Electronics World
Aug 7, 2023
The Outlook for Desk-Top Quantum Computers

The Outlook for Desk-Top Quantum Computers

Quantum computers have the potential to tackle problems it would take classical computers trillions of years to solve. Most quantum computer designs depend on cooling the hardware to extreme temperatures well below -200 degrees Celsius.
Printed Electronics World
Aug 1, 2023
Webinar - Flexible Hybrid Electronics: The Best of Both Worlds?

Webinar - Flexible Hybrid Electronics: The Best of Both Worlds?

Thursday 17 August 2023 - An introduction to FHE, including motivating factors; Discussion of recent innovations and commercial developments within FHE; Identification of technological gaps and potential solutions; A roadmap for how the industry will develop, spanning both technologies and applications.
Printed Electronics World
Jul 31, 2023
Flexible Hybrid Electronics Offers the Best of Both Approaches

Flexible Hybrid Electronics Offers the Best of Both Approaches

Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs.
Printed Electronics World
Jul 28, 2023
Webinar on Materials & Processing Trends for Semiconductor Packaging

Webinar on Materials & Processing Trends for Semiconductor Packaging

Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend
Printed Electronics World
Aug 25, 2023
Why Data Centers Adopt Cold Plates for Liquid Cooling Over Immersion

Why Data Centers Adopt Cold Plates for Liquid Cooling Over Immersion

The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.
Printed Electronics World
Aug 22, 2023
EVs to Dominate Aerogel Applications by 2025

EVs to Dominate Aerogel Applications by 2025

Aerogels have experienced steady market growth historically, reaching a market of just under US$450 million in 2022. Progress has been somewhat slower than some would expect; this has largely been due to competition with lower-cost incumbent insulation materials.
Printed Electronics World
Aug 11, 2023
Next-Generation RDL Materials in Advanced Semiconductor Packaging

Next-Generation RDL Materials in Advanced Semiconductor Packaging

With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package.
Printed Electronics World
Aug 7, 2023
The Outlook for Desk-Top Quantum Computers

The Outlook for Desk-Top Quantum Computers

Quantum computers have the potential to tackle problems it would take classical computers trillions of years to solve. Most quantum computer designs depend on cooling the hardware to extreme temperatures well below -200 degrees Celsius.
Printed Electronics World
Jul 31, 2023
Flexible Hybrid Electronics Offers the Best of Both Approaches

Flexible Hybrid Electronics Offers the Best of Both Approaches

Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs.
Printed Electronics World
Aug 23, 2023
What Role Will Membranes Play in Carbon Capture?

What Role Will Membranes Play in Carbon Capture?

CCUS is a central part of every industrial decarbonization roadmap. At its heart, this is a separation challenge, which therefore brings about the question of whether membranes can be used.
Printed Electronics World
Aug 16, 2023
Green Carbon Nanotubes: Reality or Good PR?

Green Carbon Nanotubes: Reality or Good PR?

The market for nanomaterials, especially nanocarbons, continues to grow - reflecting the potential to unlock several next-generation technologies. Most notable for carbon nanotubes (CNTs) is incorporation in lithium-ion batteries, with production ramping up to fulfill demand, while major players are making acquisitions and expanding, leading to market consolidation.
Printed Electronics World
Aug 9, 2023
Quantum Dots Unleashed: An Ever-Evolving Application Landscape

Quantum Dots Unleashed: An Ever-Evolving Application Landscape

Quantum dots (QDs) are semiconductor nanocrystals ranging from 2-10 nanometers (10-50 atoms) with size-tunable features. They exhibit quantum confinement effects due to their nanoscale dimensions, leading to remarkable optical and electrical characteristics
Printed Electronics World
Aug 1, 2023
Webinar - Flexible Hybrid Electronics: The Best of Both Worlds?

Webinar - Flexible Hybrid Electronics: The Best of Both Worlds?

Thursday 17 August 2023 - An introduction to FHE, including motivating factors; Discussion of recent innovations and commercial developments within FHE; Identification of technological gaps and potential solutions; A roadmap for how the industry will develop, spanning both technologies and applications.
Printed Electronics World
Jul 28, 2023
Webinar on Materials & Processing Trends for Semiconductor Packaging

Webinar on Materials & Processing Trends for Semiconductor Packaging

Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend
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