Printed Electronics World
May 22, 2024
Which Substrate Tech Rules for 5G and 6G AiP?
Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, antennas were positioned on PCBs; now, there's a shift towards integrating antennas directly onto the same package as the RF chip.