Wednesday 4 October 2023 - Discuss the key components of a PEM fuel cell including their form and function within the fuel cell system; Provide information on emerging technological innovation for each of the major components, both in terms of materials and manufacturing; Outline key technology trends driven by external factors such as sustainability; Overview the PEM fuel cell market within the context of the broader fuel cell electric vehicle market

The global quantum dot (QD) material market is projected to reach US$550 million by 2034. However, this remarkable figure merely scratches the surface of the potential magnitude the market of their enabled products is set to attain, especially in one of QD's potential application markets: displays.

Tuesday 3 October 2023 - Define the white biotechnology and its scope, versus other "colors" of biotechnology; Discuss several technology trends impacting white biotechnology; Highlight some of the biggest innovations taking place in white biotechnology; Analyze major market activity by leading and emerging players in white biotechnology; Present a 10-year market outlook for white biotechnology

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering. One prominent advancement in this field is the 3D Cu-Cu Hybrid Bonding technology, which offers a transformative solution. IDTechEx have been closely monitoring the advancements in 2.5D and 3D advanced semiconductor packaging.

The advancement of biotechnology is critical to expanding both the bioeconomy, where society uses renewable biological resources to create biobased products and the circular economy. Of the numerous colors of the biotechnology spectrum, in which different colors refer to different applications for biotechnology, white biotechnology stands out as a key technology enabler for the bioeconomy by advancing the industrial production of biobased products through biological systems.

Can digital and/or high throughput manufacturing be applied to circuit boards? Can stretchable electronics be produced without sacrificing processing capabilities? Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that aims to resolve both of these questions.

Wednesday 20 September 2023 - Drivers behind the greater fire safety focus in EVs; Battery design and evolution impacting material selection; Aerogels compared to other fire protection materials; Key players in the aerogel market for EVs and market progress; Outlook for the future of aerogels in EV applications

Thursday 14 September 2023 - Introduction to quantum dots and wavelength tuning approaches; Material options; QD modes of operation; QDs for display applications: unique features, various adoption approaches, introduction, manufacturing techniques, current status and trends; QDs for image sensor applications: Introduction, types, value propositions and trends; Market landscape

Managing the sustainability of Li-ion batteries at end-of-life (EOL) will continue to become increasingly important as the demand for Li-ion batteries continues to grow in sectors such as electric vehicles, stationary energy storage, and consumer electronics.

The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.

CCUS is a central part of every industrial decarbonization roadmap. At its heart, this is a separation challenge, which therefore brings about the question of whether membranes can be used.

Aerogels have experienced steady market growth historically, reaching a market of just under US$450 million in 2022. Progress has been somewhat slower than some would expect; this has largely been due to competition with lower-cost incumbent insulation materials.

The market for nanomaterials, especially nanocarbons, continues to grow - reflecting the potential to unlock several next-generation technologies. Most notable for carbon nanotubes (CNTs) is incorporation in lithium-ion batteries, with production ramping up to fulfill demand, while major players are making acquisitions and expanding, leading to market consolidation.

With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package.

Quantum dots (QDs) are semiconductor nanocrystals ranging from 2-10 nanometers (10-50 atoms) with size-tunable features. They exhibit quantum confinement effects due to their nanoscale dimensions, leading to remarkable optical and electrical characteristics

Quantum computers have the potential to tackle problems it would take classical computers trillions of years to solve. Most quantum computer designs depend on cooling the hardware to extreme temperatures well below -200 degrees Celsius.

Thursday 17 August 2023 - An introduction to FHE, including motivating factors; Discussion of recent innovations and commercial developments within FHE; Identification of technological gaps and potential solutions; A roadmap for how the industry will develop, spanning both technologies and applications.

Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs.

Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend