Hosted by IDTechEx

Printed, Flexible and Organic Electronics

IDTechEx provides independant analysis, views and reports on "the new electronics" - ultra-high volume, low cost, laminar electronic products. These are creating huge new markets, and often require alternative manufacturing processes to the traditional electronics industry.
Advanced Semiconductor Packaging Trends in AI and HPC

Advanced Semiconductor Packaging Trends in AI and HPC

Printed Electronics World
Feb 22, 2024
Tesla Adopts Interior Radar for Interior Monitoring

Tesla Adopts Interior Radar for Interior Monitoring

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.
Printed Electronics World
Jan 16, 2024
Brand New Podcast: Tomorrow's Tech by IDTechEx

Brand New Podcast: Tomorrow's Tech by IDTechEx

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.
Printed Electronics World
Jan 10, 2024
Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.
Printed Electronics World
Jan 9, 2024
Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies
Printed Electronics World
Dec 12, 2023
Regulations - Drivers for Mandating Driver Monitoring Systems

Regulations - Drivers for Mandating Driver Monitoring Systems

Driver monitoring systems (DMS) have gained considerable momentum, driven by the escalating SAE autonomous driving levels and regulatory frameworks in key regions like the USA, Europe, China, Japan, and others.
Printed Electronics World
Dec 7, 2023
High Performance Computing for Automotive

High Performance Computing for Automotive

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.
Printed Electronics World
Nov 21, 2023
Webinar - Flexible and Printed Electronics Progress and Outlook

Webinar - Flexible and Printed Electronics Progress and Outlook

Friday 1 December 2023 - Following the Money - Enabling Materials (conductive inks, CNTs and graphene); Comparisons of applicable 2D and 3D manufacturing processes; Outlook for key components including sensors, batteries and displays; Market drivers and needs
Printed Electronics World
Nov 20, 2023
Webinar - MicroLED Displays: Unveiling the Future of Visual Excellence

Webinar - MicroLED Displays: Unveiling the Future of Visual Excellence

Thursday 30 November 2023; MicroLED technologies and manufacturing processes; Values and challenges; MicroLED applications and analysis; Application roadmap; Current development status
Printed Electronics World
Nov 15, 2023
Join Our Upcoming Webinar on Advanced Semiconductor Packaging

Join Our Upcoming Webinar on Advanced Semiconductor Packaging

Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging
Printed Electronics World
Feb 22, 2024
Tesla Adopts Interior Radar for Interior Monitoring

Tesla Adopts Interior Radar for Interior Monitoring

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.
Printed Electronics World
Jan 10, 2024
Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.
Printed Electronics World
Dec 12, 2023
Regulations - Drivers for Mandating Driver Monitoring Systems

Regulations - Drivers for Mandating Driver Monitoring Systems

Driver monitoring systems (DMS) have gained considerable momentum, driven by the escalating SAE autonomous driving levels and regulatory frameworks in key regions like the USA, Europe, China, Japan, and others.
Printed Electronics World
Nov 21, 2023
Webinar - Flexible and Printed Electronics Progress and Outlook

Webinar - Flexible and Printed Electronics Progress and Outlook

Friday 1 December 2023 - Following the Money - Enabling Materials (conductive inks, CNTs and graphene); Comparisons of applicable 2D and 3D manufacturing processes; Outlook for key components including sensors, batteries and displays; Market drivers and needs
Printed Electronics World
Nov 15, 2023
Join Our Upcoming Webinar on Advanced Semiconductor Packaging

Join Our Upcoming Webinar on Advanced Semiconductor Packaging

Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging
Printed Electronics World
Jan 16, 2024
Brand New Podcast: Tomorrow's Tech by IDTechEx

Brand New Podcast: Tomorrow's Tech by IDTechEx

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.
Printed Electronics World
Jan 9, 2024
Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies
Printed Electronics World
Dec 7, 2023
High Performance Computing for Automotive

High Performance Computing for Automotive

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.
Printed Electronics World
Nov 20, 2023
Webinar - MicroLED Displays: Unveiling the Future of Visual Excellence

Webinar - MicroLED Displays: Unveiling the Future of Visual Excellence

Thursday 30 November 2023; MicroLED technologies and manufacturing processes; Values and challenges; MicroLED applications and analysis; Application roadmap; Current development status
More IDTechEx Journals