The Paris 2024 Olympic Games are underway, and elite athletes from all over the world are competing in various games using a range of different skills. With constant debate over gold, silver, and bronze medals, a comparison can be made with the conductive inks market. Silver flake-based inks are set to win gold in a number of different application areas, beating out competition from a host of conductive ink types.

IDTechEx expects the printed and flexible sensor market to reach US$960 million by 2034, with a compound annual growth rate of 8.6%. Being connected to infrastructure systems or partnering with suppliers and distributors will help printed sensors take off, alongside their ability to be available at scale, robust, and have long product lifetimes.

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. Thermal fillers are highly thermally conductive substances, while matrix materials are typically used to enhance mechanical properties.

Wednesday 3 July 2024 - Introduction to the broad family of conductive inks; Status and outlook for the dominant conductive ink type, silver flake-based ink, including an assessment of current demand and a ten-year forecast; Overview of emerging applications; Critical assessment of the outlook for non-silver inks such as stretchable/thermoformable inks and copper inks.

The conductive inks market will grow to exceed US$6.5 billion by 2034 but remains a highly segmented industry, underpinning both photovoltaics and the emerging field of printed electronics. Taking stock of the different outlooks for the myriad of conductive ink types and the various application areas is a complex task. IDTechEx has tackled this problem by assessing the market for different conductive ink types across 15 application areas and providing granular ten-year market forecasts.

2024 has marked the 20th anniversary of the original isolation of graphene, first achieved at the University of Manchester in 2004, prior to the award of the Nobel Prize in Physics in 2010. In the two decades since its isolation, graphene has been the subject of immense hype, labeled as a wonder material with superlative properties capable of enabling society-shifting technologies.

With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).

Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.

Thursday 16 May 2024 - An overview of 3D electronics including electronics on 3D surfaces, in-mold electronics and fully additive electronics; Technology benchmarking on conventional and emerging metallization methods; Discussion of the status, challenges and opportunities across the whole 3D electronics industry; Market opportunities and outlook

Sensors act as a middle ground between the physical and digital. They measure all sorts of variables from touch, temperature, and heart rate across many different sectors, which IDTechEx's report "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets" explores in detail. As technology continues to become streamlined and autonomous, there is a great demand for multi-functionality and seamlessness, meaning a high demand for sensors that can be printed and applied to flexible surfaces. IDTechEx explores the main sectors where this technology is in most demand.

Flexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.

3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

IDTechEx Research announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials, and applications of electronics added to 3D surfaces, in-mold electronics (IME), and fully printed 3D electronics.

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?

In-cabin monitoring, comprising both Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS), has experienced significant growth since the start of 2024. Traditionally, DMS relies on 2D infrared cameras, while OMS utilizes 3D sensing modules like 3D time-of-flight (ToF) cameras or radar modules.

In March, the printed electronics industry flocked to Munich once again for the LOPEC 2024 conference and exhibition. Featured were some of the latest printed electronics technologies addressing global mega-trends such as vehicle electrification, healthcare personalization, industry 4.0, and sustainability.

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.