Although graphene and carbon nanotubes have long been touted as "wonder materials" with the potential to address numerous global challenges, the initial excitement did not quickly lead to widespread commercial success. IDTechEx has closely monitored the nanocarbon market for over ten years, and this article will evaluate the application areas where graphene and CNTs are likely to achieve notable success in the next ten years.

As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density. Chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.

Concerns over incumbent strategies for PFAS waste management have created opportunities for novel PFAS destruction technologies to potentially disrupt the status quo. Universities and independent start-ups are developing numerous different destruction technologies.

On Tuesday, November 5th, millions of Americans went to the polls to vote for the 47th President of the United States. The results were emphatic: a second Trump administration and a Republican-controlled Senate. While this election will impact many aspects of the global economy, what do these results entail for one of the world's biggest automotive markets?

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

Thursday 7 November 2024 - Which Technology Innovations Will Be Most Disruptive in the Global Sensor Market? An overview of meta-trends shaping the sensor market landscape; A summary of major market verticals, product types and leading technologies; Coverage of near-term trends in sensor technology development, adoption and integration - including the impact of AI on edge sensing; An overview of disruptive emerging sensor technologies recently commercialized, their value proposition, advantages and market challenges. This includes printed sensors, quantum sensors, emerging image sensors, biosensors, gas sensors and nanocarbon sensors; Case studies in fast growing markets for sensors technology, both established and emerging, such as future mobility, wearables and IoT (industrial, consumer and environmental); Initial ten-year forecasting insights and sensor market outlook for the next ten years

Thursday 14 November 2024 - Chiplet Technology: Revolutionizing Semiconductor Design and Integration; Definition and significance of chiplets in modern semiconductor design; Comparison with SoC and SiP technologies; Introduction to heterogeneous integration; Drivers and advantages of adopting chiplet technology; Brief overview of challenges in implementing chiplets; Insights into the future potential and impact of chiplet technology

Monday 25 November 2024 - Navigating The Momentum Pushing the Per- And Polyfluoroalkyl Substances (PFAS) Treatment Market to US$2.3 billion by 2035. Regulatory trends and standards from key regions such as the US, the EU, and Asia-Pacific, highlighting differences in regulations and their implications for PFAS treatment markets; The incumbent and emerging PFAS treatment technology landscape: granular activated carbon, ion exchange resins, foam fractionation, etc; Introduction to PFAS destruction and relevant technologies; Key players in PFAS removal and destruction technologies

While sensors contribute just a fraction of the annual revenue generated by major electronics companies, sensor technology nevertheless represents a multi-billion-dollar global market.

The electrification of vehicle fleets globally continues to create demand for rare earth magnets. With China being the largest electric vehicle market, rare earth permanent magnet motors are expected to retain the majority of the electric motor market share.

Given helium's critical role in semiconductor production, onshoring chip manufacturing will have a significant knock-on impact on the helium demand for semiconductor manufacturing.

While most of the voluntary market saw a downturn in 2023, corners of the market selling durable, carbon removal credits are flourishing and playing a vital role in supporting emerging technologies such as direct air capture and CO2 utilization in concrete.

Leading companies like AMD and Intel have adopted chiplet designs in products such as AMD's EPYC processors and Intel's Ponte Vecchio GPUs. This widespread adoption underscores the growing importance of chiplets in high-performance computing applications.

With so many PFAS and just as many applications for them, why are PFAS now coming under increased scrutiny? Scientific evidence is growing that, depending on different factors, continued exposure to specific PFAS may lead to negative health effects, such as increased risk of cancer, per the US EPA and the OECD.

As the world grapples with plastic waste, which is set to double by 2050, recycling alone cannot meet the growing demand for plastic feedstocks. This is where bioplastics come into play, offering a potential solution to reduce dependency on fossil fuels and minimize the environmental footprint.

Despite much investment and interest, some key questions surrounding sustainability and economic viability, as well as new regulatory pressures, are putting into question the future of this technology.

CPO represents a significant leap in data transmission technology by integrating the optical engine and the switching silicon onto the same substrate. This design eliminates the need for signals to traverse the PCB, further reducing the electrical channel path and significantly improving performance.

Thursday 10 October 2024 - An overview of bioplastics; How new Chinese regulations are transforming the industry; How other countries are approaching bioplastics regulations; The changing landscape of bioplastic applications; Why bio-composites using bioplastics are seeing increased interest and their challenges; IDTechEx's outlook and conclusions