Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

The RFID industry is expected to maintain its growth trajectory, with IDTechEx forecasting a market value of US$14 billion in 2023, up from US$12.8 billion in 2022. This market value encompasses various RFID form factors, including labels, cards, fobs, and tags, as well as scanners, software, and services for both active and passive RFID technologies. Among these, the "Passive RFID Tags" segment stands out as the largest, comprising more than half of the total RFID market.

Thermal Interface Materials (TIMs) come in different forms, including thermal pads, thermal grease, gap fillers, thermal paste, and thermal gels. Thermal gel and thermal paste, two of the most commonly used forms, have gained significant momentum over the past several years, especially in the EV, data center, and 5G industries.

Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common. Applications range from vehicle interiors and domestic appliances to medical devices and aircraft seating. Rather than relying on a mechanical or membrane switch, these surfaces utilize capacitive touch sensing - the same principle used in smartphone displays.

Wednesday 17 May 2023 - Multiple smart packaging technologies, including embedded lighting, wireless energy harvesting, flexible batteries, and low-cost sensing; Case studies showing the deployment and adoption of different types of smart packaging, such as electronic blister packs for pharmaceuticals; A roadmap for the adoption of different smart packaging technologies, and assessment of technology gaps and other adoption barriers