Webinar Title: Market and Technology Trends in Advanced Semiconductor Packaging
Date: Thursday 25 August 2022
Presenter: Dr Yu-Han Chang, Technology Analyst - IDTechEx
Space is limited - reserve your seat today!
Today, data is exploding at every level and in almost every industry. Machine learning and AI are crucial data enablers in a wide range of applications, including data centres, 5G, and autonomous cars. To operate these programmes, a powerful processor is necessary, with an integrated circuit (IC) made on Si serving as the basis.
For decades, IC design house would build a chip with all functionalities integrated on a single die; however, as Moore's law slows (chip density are no longer doubling every two years), scaling monolithic IC becomes increasingly complex and costly. This forces IC manufacturers to pursue "advanced semiconductor packaging technologies". In comparison to conventional packaging technologies, advanced semiconductor packaging technologies, such as 2.5DIC and 3DIC, promises higher chip connection and lower power consumption, enabling the IC vendor to continue to supply high performance chips at a reasonable price.
In this webinar, Dr. Yu-Han Chang will present IDTechEx's latest data and prospects for the advanced semiconductor packaging industry, which will include research from IDTechEx's latest market research study "Advanced Semiconductor Packaging 2023-2033".
This webinar will provide an overview of the current state of the advanced semiconductor packaging industry. The contents include:
- Analysis of advanced semiconductor packaging markets and their mid-long-term opportunity
- Key applications' growth drivers
- Player analysis - the dynamics of advanced semiconductor packaging battleground
- Advanced semiconductor packaging technologies - current challenges and innovative trends
Register Your Free Place
We will be holding exactly the same webinar three times in one day. Please register for the session most convenient for you.
Date: Thursday 25 August 2022
Duration: Approx. 30 minutes
Webinar #1: Asia-Pacific
9:00am (UTC+8) Singapore, Taipei, Beijing
9:00am (UTC+8) Australian Western Standard Time
10:00am (UTC+9) Tokyo, Seoul
10:30am (UTC+9.30) Australian Central Time
11:00am (UTC+10) Australian Eastern Time
1:00pm (UTC+12) Auckland, New Zealand
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Webinar #2: Europe
10:00am (UTC+1) London
11:00am (UTC+2) Amsterdam, Berlin, Rome
12:00noon (UTC+3) Athens, Jerusalem
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Webinar #3: Americas
9:00am (Pacific Time PT) USA & Canada
10:00am (Mountain MST) USA & Canada
11:00am (Central CST) USA & Canada
12:00noon (Eastern EST) USA & Canada
5:00pm (UTC+1) London
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