Graphene and Carbon Nanotubes

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Thursday 27 July 2023 - Surging Demand for Lithium-Ion Batteries Driving the Carbon Nanotube Market. 10-year market outlook for CNTs; Analysis of CNT usage in the energy storage industry, including technology trends in LiBs and next generation batteries; Overview of other key applications; Discussion of key players and supply chain pain points; Emerging technologies incl. green feedstock

The energy storage market is booming, driven predominantly by the electrification of the transportation sector. With the increasing demand for lithium-ion batteries (LiB), significant attention has been given to the supply chain of materials for LiBs beyond lithium itself. Carbon nanotubes (CNTs) are gaining traction as a conductive additive at the cathode of LiBs, paving the way for significant expansion in the CNT market.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

Thermal Interface Materials (TIMs) come in different forms, including thermal pads, thermal grease, gap fillers, thermal paste, and thermal gels. Thermal gel and thermal paste, two of the most commonly used forms, have gained significant momentum over the past several years, especially in the EV, data center, and 5G industries.

Thursday 20 April - The Surging Market for Thermal Interface Materials. This webinar will give a general overview of the TIMs used in EV, Data Center, ASAS, EMI shielding, 5G, and Consumer Electronics. The webinar discusses how TIM properties and demand will change with an analysis of the market trend and industrial news and collaborations.

Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase change materials.

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer.

Using graphene to improve the performance of energy storage devices has been a key focus ever since the 2D material was isolated. As soon as the first commercial graphene manufacturers were established, there has been a steady stream of announcements related to batteries, but perhaps none are as significant as the 2023 news of Evonik entering the field with their investment in SuperC.