Wednesday 12 July 2023 - An introduction to printed and flexible electronics, including motivating factors; Assessment of product-market fit across the application space, including discussion of use cases seeing most commercial traction; A selection of recent innovations, spanning materials, components, and manufacturing methods; A roadmap for how the industry will develop, spanning both technologies and applications

Walk around the aisles of a local shop: aside from the prices, little has changed since the introduction of the bar code in the 1970s. While customers have smartphones in their pockets and there are sophisticated inventory management systems in the background, the digital revolution has yet to alter the packaging of most consumer items.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

What do electronic skin patches, thin-film flexible photovoltaics and automotive interior consoles have in common? All are produced using printed & flexible electronics, an alternative approach to conventional printed circuit boards that combines additive manufacturing with flexible substrates.

Wednesday 28 June - Where Metamaterials Meet Tele-Communications. What is a reconfigurable intelligent surface (RIS), and why are they likely to be needed for high frequency telecommunications.; The different types of RIS (passive, semi-passive, active) and where they are likely to be deployed; Manufacturing processes and materials required for RIS production.

Anyone who has used a 'smart lens' app on their smartphone is familiar with machine vision. Rather than simply reproducing and storing a picture for later viewing, machine vision applies an image processing algorithm to obtain additional insight, such as locating edges or object identification.

What is packaging for? From its initial purpose of simply protecting the product to driving sales via consumer engagement, the role of packaging has substantially evolved. Smart/intelligent packaging continues this trend towards greater functionality, employing sensors, printed electronics, and wireless communication to add value in novel ways.

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

The RFID industry is expected to maintain its growth trajectory, with IDTechEx forecasting a market value of US$14 billion in 2023, up from US$12.8 billion in 2022. This market value encompasses various RFID form factors, including labels, cards, fobs, and tags, as well as scanners, software, and services for both active and passive RFID technologies. Among these, the "Passive RFID Tags" segment stands out as the largest, comprising more than half of the total RFID market.

Thermal Interface Materials (TIMs) come in different forms, including thermal pads, thermal grease, gap fillers, thermal paste, and thermal gels. Thermal gel and thermal paste, two of the most commonly used forms, have gained significant momentum over the past several years, especially in the EV, data center, and 5G industries.

Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common. Applications range from vehicle interiors and domestic appliances to medical devices and aircraft seating. Rather than relying on a mechanical or membrane switch, these surfaces utilize capacitive touch sensing - the same principle used in smartphone displays.

Wednesday 17 May 2023 - Multiple smart packaging technologies, including embedded lighting, wireless energy harvesting, flexible batteries, and low-cost sensing; Case studies showing the deployment and adoption of different types of smart packaging, such as electronic blister packs for pharmaceuticals; A roadmap for the adoption of different smart packaging technologies, and assessment of technology gaps and other adoption barriers

Materials informatics is the application of data-driven methods, including machine learning techniques, to the field of materials science. This important part of the digital transformation toolbox for the materials industry has wide-ranging benefits, but the ability to enhance the sustainability of materials and their manufacturing processes could be the most impactful of these.

The role of packaging has evolved over time, from simply protecting and identifying the product to driving sales via enticing graphics. Smart packaging is the latest iteration, utilizing technology including sensors, indicators, and wireless communication to enhance user engagement, product quality, and supply chain efficiency.

Wednesday 26 April 2023 - The current state of the industry, including a comprehensive analysis of the NFC and RAIN markets and their medium-term opportunities; The RFID market by regions, key growth drivers for various applications, and the remaining barriers to high-volume RFID adoption; Emerging technologies that could pose a threat to the RFID industry and innovative trends in RFID technologies that can help businesses stay ahead of the competition

Thursday 20 April - The Surging Market for Thermal Interface Materials. This webinar will give a general overview of the TIMs used in EV, Data Center, ASAS, EMI shielding, 5G, and Consumer Electronics. The webinar discusses how TIM properties and demand will change with an analysis of the market trend and industrial news and collaborations.

Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase change materials.

Asked whether electronics is a 'digital technology', almost everyone would reply in the affirmative. However, while printed circuit boards (PCBs) enable digital technologies, the manufacturing processes used to produce them are still largely analog.

The RFID business continues to grow. The global RFID market is anticipated to continue to grow in 2023, with IDTechEx projecting a market value of US$14 billion in 2023, up from US$12.8 billion in 2022. This market value comprises of RFID labels, cards, fobs, and other form factors, as well as tags, scanners, and software/services for inactive and active RFID.

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer.