Webinar Title: Printed and Flexible Electronics: State of the Industry
Date: Wednesday 12 July 2023
Space is limited - book your seat today!
Spanning many materials, technologies and potential use cases, the breadth of the printed and flexible electronics industry can seem daunting. Much like its conventional counterparts, circuits made from printed and flexible electronics can be found across all market verticals. Applications range from building integrated photovoltaic panels to car seat occupancy sensors and from electronic skin patches to smart packaging on consumer goods. With so many options, identifying the most promising product-market fit and opportunities for technical innovation can be challenging.
Drawing on IDTechEx's many years of experience tracking developments across the printed/flexible electronics space, including numerous interviews and regular conference attendance, this webinar will provide an update on the state of the industry, and how it is likely to progress.
Dr Matthew Dyson, a Principal Technology Analyst at IDTechEx who covers printed/flexible electronics, will discuss the following topics:
- An introduction to printed and flexible electronics, including motivating factors
- Assessment of product-market fit across the application space, including discussion of use cases seeing most commercial traction
- A selection of recent innovations, spanning materials, components, and manufacturing methods
- A roadmap for how the industry will develop, spanning both technologies and applications
This webinar is based on the recently released IDTechEx report, "Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets". This outlines innovations, opportunities, and trends across 5 sectors of the printed and flexible electronics market: automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial. Additionally, the report outlines developments across multiple aspects of the printed and flexible electronics market: 6 distinct manufacturing modalities (including in-mold electronics and flexible hybrid electronics), 5 material types (including conductive inks and component attachment materials), and 4 component types (including flexible ICs).
Register Your Free Place
We will be holding exactly the same webinar three times in one day. Please register for the session most convenient for you.
Date: Wednesday 12 July 2023
Duration: Approx. 30 Minutes
Webinar #1: Asia-Pacific
9:00am (UTC+8) Singapore, Taipei, Beijing
9:00am (UTC+8) Australian Western Standard Time
10:00am (UTC+9) Tokyo, Seoul
10:30am (UTC+10.30) Australian Central Time
11:00am (UTC+11) Australian Eastern Time
1:00pm (UTC+13) Auckland, New Zealand
Webinar #2: Europe
10:00am (UTC) London
11:00am (UTC+1) Amsterdam, Berlin, Rome
12:00noon (UTC+2) Athens, Jerusalem
Webinar #3: Americas
9:00am (Pacific Time PT) USA & Canada
10:00am (Mountain MST) USA & Canada
11:00am (Central CST) USA & Canada
12:00noon (Eastern EST) USA & Canada
5:00pm (UTC) London