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Posted on June 28, 2017 by  & 

Webinar Tuesday 11 July - Encapsulation of Flexible Electronics

Webinar Title: Encapsulation of Flexible Electronics: to TFE or not to TFE?
Date: Tuesday 11 July 2017
Presenter: Dr. Harry Zervos, Principal Analyst, IDTechEx
Space is limited - reserve your seat today!
Encapsulation of Flexible Electronics: to TFE or not to TFE?
That, and other questions relating to the development of flexible barrier films and thin film encapsulation (TFE) technology will be answered during this webinar discussing findings from the new IDTechEx report Barrier Layers for Flexible Electronics 2017-2027.
The launch of the first portable devices incorporating flexible displays, a major milestone, signals an era of decision making ahead, relating to whether in-line deposition or the barrier film + adhesive approach fits each application best.
Dr. Zervos will discuss this topic, alongside forecasted growth per sector and key enabling manufacturing technologies. The webinar will cover:
  • PE-CVD vs. ALD
  • Application road map and forecasts by application
  • Quantum dots: why the reluctance?
  • Flexible displays on the road to flexible end products
We will be holding exactly the same webinar twice in one day. Please register for whichever session is most convenient for you. Regular attendees please be aware that our morning sessions now start at 10am BST/GMT+1.
Date: Tuesday 11 July 2017
Duration: 30 minutes plus 10 minutes for Q&A
Webinar #1: Europe & Asia-Pacific
10:00am (BST/GMT+1) London
11:00am (GMT+2) Amsterdam, Berlin, Rome
12:00noon (GMT+3) Athens, Jerusalem
4:00pm (GMT+7) Bangkok
5:00pm (GMT+8) Singapore, Taipei, Beijing
6:00pm (GMT+9) Tokyo, Seoul
7:00pm (GMT+10) Canberra
Webinar #2: Americas
9:00am (Pacific DT) USA & Canada
10:00am (Mountain DT) USA & Canada
11:00am (Central DT) USA & Canada
12:00noon (Eastern DT) USA & Canada
5:00pm (BST/GMT+1) London
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