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Printed Electronics World
Posted on March 5, 2020 by  & 

Video: Thinning a Silicon Chip Could Make it More Durable

Making it Thinner Than a Human

American Semiconductor (ASI) has installed the world's first ultra-thin wafer-level Chip Scale Packaging operation and assembly service in Boise, ID in 2019. ASI is the industry leader in flexible integrated circuits as well as a services provider for Flexible-Hybrid-Electronic (FHE) system design and prototype assembly. Standard and custom Semiconductor-on-Polymer (SoP) ICs are available ranging from OPAMPS to complex system-on-chip (SoC) to NFC and BLE.
 
Filmed at IDTechEx Show! USA 2019
Learn more at the next leading event on the topic: Printed Electronics Europe 2020 External Link on 13 - 14 May 2020 at Estrel Convention Center, Berlin, Germany hosted by IDTechEx.

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Posted on: March 5, 2020

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