Webinar Title: Emerging Application Opportunities for Conductive Inks
Date: Thursday 22 October 2020
Presenter: Dr Matthew Dyson, Technology Analyst, IDTechEx
Space is limited - reserve your seat today!
Conductive inks are an established market of over $2bn, with screen-printed conductive traces for silicon solar panels by far the dominant application. However, there is also much innovation in the sector, with particle-free, stretchable, thermoformable and copper inks being developed to target new applications such as in-mold electronics and e-textiles.
The webinar will begin by outlining the wide range of differentiating factors for conductive inks, then discussing the technical features and attributes of the main types of conductive ink. Trade-offs to consider when selecting or developing a conductive ink will be highlighted. Emerging applications for conductive inks will then be reviewed, covering wearable skin patches, e-textiles, in-mold electronics (IME), additive manufacturing (3D printed electronics, circuit prototyping) and how the transition towards flexible hybrid electronics (FHE) will create extensive opportunities for conductive inks to replace etched copper.
This webinar includes:
- Discussion of the various types of conductive inks, their differentiating factors, readiness level, and the applications to which they are best suited.
- Overview of the latest market forecast and conductive ink applications, highlighting those that are predicted to see the most growth over the next 10 years.
- Analysis of technological transitions and associated innovation opportunities.
More detailed information, including the full market forecasts, can be found in IDTechEx's extensive report on the topic: "Conductive Ink Markets 2020-2030: Forecasts, Technologies, Players". This covers all types of conductive inks, along with over 30 different applications. This includes PV, 5G, Automotive, Power Electronics, EMI shielding, In-Mold Electronics, e-Textiles, Skin Patches, Printed Sensors, Flexible Hybrid Electronics, RFID, 3D Metallization, Heating, Hybrid/Printed Metal Mesh and more.
We will be holding exactly the same webinar three times in one day. Please register for the session most convenient for you.
Date: Thursday 22 October 2020
Duration: 40 minutes
Webinar #1: Asia-Pacific
9:00am (GMT+8) Singapore, Taipei, Beijing
9:00am (GMT+8) Australian Western Standard Time
10:00am (GMT+9) Tokyo, Seoul
11:30am (GMT+9.30) Australian Central Time
12:00noon (GMT+10) Australian Eastern Time
2:00pm (GMT+12) Auckland, New Zealand
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Webinar #2: Europe
10:00am (GMT) London
11:00am (GMT+1) Amsterdam, Berlin, Rome
12:00noon (GMT+2) Athens, Jerusalem
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Webinar #3: Americas
9:00am (Pacific Time PT) USA & Canada
10:00am (Mountain MST) USA & Canada
11:00am (Central CST) USA & Canada
12:00noon (Eastern EST) USA & Canada
5:00pm (GMT) London
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Contact Us: annick@IDTechExWebinars.com
