Printed, Flexible and Organic Electronics

In-cabin monitoring, comprising both Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS), has experienced significant growth since the start of 2024. Traditionally, DMS relies on 2D infrared cameras, while OMS utilizes 3D sensing modules like 3D time-of-flight (ToF) cameras or radar modules.

In March, the printed electronics industry flocked to Munich once again for the LOPEC 2024 conference and exhibition. Featured were some of the latest printed electronics technologies addressing global mega-trends such as vehicle electrification, healthcare personalization, industry 4.0, and sustainability.

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies

Driver monitoring systems (DMS) have gained considerable momentum, driven by the escalating SAE autonomous driving levels and regulatory frameworks in key regions like the USA, Europe, China, Japan, and others.

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.